Baseband Designs and Protocol Stack Software to be Integrated in Dual Mode Chips
KING OF PRUSSIA, Pa.--(BUSINESS WIRE)--Feb. 27, 2008--InterDigital, Inc. (NASDAQ:IDCC) announced it has licensed its 3G modem technology to a leading Asian fabless semiconductor company. InterDigital's SlimChip(TM) Mobile Broadband Modem IP, high-performance WCDMA/HSDPA/HSUPA baseband designs and protocol stack software, has been selected for integration in the company's dual mode chips. Under the licensing agreement, InterDigital will provide complete UMTS 3GPP Release 6 modem technology and customer support.